Lee Ultrasound Imaging Group

Wei-Ning Lee, Ph.D.

Email: wnlee at eee dot hku dot hk
Tel.: (852)3917 2703
Office: Chow Yei Ching Building, Room 506

Ph.D. Student EEE, The University of Hong Kong
Sep 2021 - Present
M.S. in Data Science, New York University
2021
B.S. in Applied Mathematics, University of New Hampshire
2019
Email: ght09 at connect dot hku dot hk
Office: CB 722

Main research area: Deep learning, medical image processing.

Ph.D. Student EEE, The University of Hong Kong
Dec 2021 - Present
M.Phil. in Biophysics, The Chinese University of Hong Kong
2021
B.S. in Materials Physics, Northwestern Polytechnical University
2019
Email: wangrenxian1 at gmail dot com
Office: CB 722

Main research area: Super-resolution ultrasound imaging, medical image analysis.

Ph.D. Student EEE, The University of Hong Kong
Sep 2022 - Present
Research Assistant in EEE, The University of Hong Kong
2022
B.Eng. in Medical Engineering, The University of Hong Kong
2021
Email: oonwy at connect dot hku dot hk
Office: CB 722

Main research area: Acoustoelectric imaging.

Ph.D. Student EEE, The University of Hong Kong
Sep 2022 - Present
Research Assistant in EEE, The University of Hong Kong
2022
M.Eng. in Biomedical Engineering, Tsinghua University
2020
B.S. in Electrical engineering and automation, Huazhong University of Science and Technology
2017
Email: u3008996 at connect dot hku dot hk
Office: CB 210

Main research area: Medical ultrasound imaging, signal processing, deep learning in medical image processing.

Ph.D. Student EEE, The University of Hong Kong
Sep 2023 - Present
B.S. in Biomedical Engineering, Sun Yat-sen University
2023
Email: jiajingz at connect dot hku dot hk
Office: CB 210

Main research area: Deep learning, medical image processing, ultrasound imaging.

Ph.D. Student EEE, The University of Hong Kong
Sep 2023 - Present
M.S. in Electrical and Computer Engineering, UIUC
2023
B.S. in Electronic and Information Engineering, Beijing Institute of Technology
2019
Email: bingzed at connect dot hku dot hk
Office: CB 210

Main research area: 3D Medical ultrasound imaging, shear wave, power doppler, signal processing, deep learning.

Ph.D. Student EEE, The University of Hong Kong
Sep 2024 - Present
M.S. in Mechanics Engineering, Xian Jiaotong University
2023
B.S. in Automobile Engineering, Hefei University of Technology
2020
Email: sqyang at connect dot hku dot hk
Office: CB 722

Main research area: Shear wave imaging and techniques, ultrasound nondestructive detecting, signal processing.

Ph.D. Student EEE, The University of Hong Kong
Nov 2024 - Present
M.Phil. in EEE, The University of Hong Kong
2024
B.S. in Electronic Engineering, Fudan University
2022
Email: u3008920 at connect dot hku dot hk
Office: CB 722

Main research area: Deep learning, signal processing, medical image processing.

Ph.D. Student EEE, The University of Hong Kong
Jan 2025 - Present
B.Eng. in Biomedical Engineering, Michigan University
2024
Email: alvinguan_eee at connect dot hku dot hk
Office: CB 722

Ph.D. Student EEE, The University of Hong Kong
Sep 2025 - Present
Research Assistant in EEE, The University of Hong Kong
Oct 2024 - Sep 2025
B.Eng in Biomedical Engineering, The Hong Kong University of Hong Kong
2024
Email:  baiqianq at connect dot hku dot hk
Office: CB 210

Main research area: Medical ultrasound imaging, acoustoelectrical imaging.

Ph.D. Student EEE, The University of Hong Kong
Sep 2025 - Present
M.S. in Biomedical Engineering, Shanghai Jiao Tong University
2025
B.S. in Biomedical Engineering, Tianjin Technology University
2022
Email: easoncyc dot 2000 at connect dot hku dot hk
Office: CB 210

Main research area: Acoustoelectric imaging.

Postdoctoral Fellow in EEE, The University of Hong Kong
Sep. 2024-Present
Ph.D. EEE, The University of Hong Kong
2024
Research Assistant EEE, The University of Hong Kong
2018-2019
M.S. EEE, The University of Hong Kong
2018
B.Eng. in Detection Guidance and Control Technology, Northwestern Polytechnical University
2017
Email: tyc2017 at connect dot hku dot hk
Office: CB 722

Main research area: Medical ultrasound imaging, strain imaging, acoustoelectrical imaging.

Ph.D. in EEE, The University of Hong Kong
2024
B.Eng. in Electrical and Electronic Engineering, University of Science and Technology Beijing
2019
Email: xuyue97 at connect dot hku dot hk

Main research area: Medical ultrasound imaging, tissue property estimation using strain imaging.

Now: Postdoc at Duke University, Durham, NC, USA

Ph.D. in EEE, The University of Hong Kong
2024
M.Eng. in Optical Engineering, Chongqing University
2019
B.Eng. in Wuhan University of Technology & B.B.A. in Wuhan University (Double major)
2016
Email: xcwu at eee dot hku dot hk
Office: CB 722

Main research area: Medical ultrasound imaging, image processing.

Now: R&D at SonoScape (Shenzhen)

Ph.D. in EEE, The University of Hong Kong
2023
M.Phil. in imaging and interventional radiology, The Chinese University of Hong Kong
2015
B.Eng. in Computer Software Engineering, Northwestern Polytechnical University
2013
Email: xfsun at eee dot hku dot hk

Main research area: Medical image analysis, deep learning, and biomedical ultrasound.

Now: HONOR (Beijing)

Ph.D. in EEE, The University of Hong Kong
2023
B.Eng. in Building Science, Tsinghua University
2018
Email: wangad at connect dot hku dot hk

Main research area: Deep learning, medical image processing, explainable AI.

Now: Tencent (Shenzhen)

Ph.D. in EEE, The University of Hong Kong
2021
M.E., Wuhan University,
2015
B.S., Wuhan University & B.E. (Double Major), Wuhan University of Technology,
2012
Email:dongjp1990 at gmail dot com

Main research area: : Tissue characterization using ultrasound-based shear wave imaging and strain imaging, finite element analysis.

Now: Lecturer at Beijing University of Technology

Ph.D. in EEE, The University of Hong Kong
2021
M.Eng. in Electronics and Communication Engineering, Xidian University
2017
B.Eng. in Information Countermeasures Technology, Xidian University
2014
Email: randan at eee dot hku dot hk

Main research area: Medical ultrasound imaging, signal processing, image processing.

Now: R&D at Mindray Medical International Limited

Ph.D. in EEE,The University of Hong Kong
2020
M.Eng. in Nondestructive Testing & Evaluation, Institute of Metal Research, Chinese Academy of Science
2016
B.Eng. in Material Shaping and Control Engineering, China University of Petroleum (East China)
2013
Email: wangyahua at connect dot hku dot hk

Main research area: Shear wave imaging, nonlinear ultrasound

Now: R&D at GE Medical Systems

Ph.D. in EEE, The University of Hong Kong
Sep 2015 - 2019
M.Eng. in signal and information processing, Peking University
2015
B.Eng. in Information Engineering, South China University of Technology
2012
Email: zhangy at eee dot hku dot hk

Main research area: Signal processing, imaging technology, biomedical ultrasound, shear wave imaging, and image processing.

Now: Assistant Professor at Tsinghua University, Beijing, China

Postdoctoral Fellow in EEE, The University of Hong Kong
2017-2020
Ph.D. in EEE, The University of Hong Kong
2017
M.S.  Huazhong University of Science and Technology
2013
B.S. South China University of Science and Technology
2009
Email: heli at eee dot hku dot hk

Main research area: medical ultrasound imaging, signal/image processing, strain imaging, high-frame-rate ultrasound, cardiac mechanics, etc.

Now: R&D at Vinno Technology (Suzhou)

Ph.D. in EEE, The University of Hong Kong
Sep 2013 - 2017
B.Sc. (Eng) in Medical Engineering, The University of Hong Kong
2013
Email: shinianmyj at gmail dot com

Main research area: Ultrasonic imaging, focusing on speckle reduction, shear wave imaging and ultra-fast imaging.

Now: R&D at Mindray Medical International Limited

Main research area: Ultrasound shear wave imaging, medical image analysis.

Research Assistant in EEE, The University of Hong Kong
Oct 2019 - Aug 2020
M.Eng. in Information and Communication Engineering, Beijing University of Posts and Telecommunications
2016-2019
B.Eng. in Communication Engineering, Jilin University
2012-2016
Email: zhang_xin at bupt dot edu dot cn

Now: PhD student, School of Biomedical Sciences, HKU

Research Assistant EEE, The University of Hong Kong
Oct 2013 – Sep 2016
M.Phil. Diagnostic Radiology, The University of Hong Kong
2013
B.Sc.(Hons) BME, Hong Kong Polytechnic University
2011
Email: eugenexueyu at gmail dot com

Now: Product Manager at Siemens Shenzhen Magnet Resonance (SSMR)